Manufacturing Requirements

Manufacturing Capabilities

Our contract manufacturing capabilities range from through-hole manufacturing to surface mount (SMT) assembly of fine pitched components. Our capabilities include accurate placement of 0402 package parts and micro BGA components with optical and X-Ray inspection.

Information Required for Production

  • Complete sets of Gerber for ordering boards
  • Gerber file for making stencil (paste layer)
  • Number of component pads or holes for price estimating (if available)
  • One extra set board for accurate oven profiling (solder sample)
  • Bill of material with a complete list of approved manufacturers, vendors, and approved crosses
  • Set of pick place coordinate in electronic Excel form perferred. (Used in pick & place machine and inspection machine)
  • Load instruction or bill of material with component reference. (R1, C1, U1)
  • Special assembly instruction notes (if any)
  • Testing procedure or information if it is part of the service

Charges

  • First time customers will not be charged a $200 setup fee on new boards
  • One time stencil charge of $300 per side

Other notes

  • For best pricing, turn time is about three weeks; this allows us to shop for the best pricing from various suppliers
  • Price will be adjusted for quick turn
  • Price breaks for larger quantity order
  • Engineering or tech contact for technical questions as they arise
For manufacturing quotes and inquiries send email to: manufacturing@link-comm.com.